AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

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ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

FEATURES

• Compact slim body saves space

Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the packaging density can be increased to allow for much smaller designs.

• Outstanding surge resistance.

Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part 68) Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)

• The use of twin crossbar contacts ensures high contact reliability.

AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.

• Increased packaging density

Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before.

• Nominal operating power: 140 mW

• Outstanding vibration and shock resistance.

Functional shock resistance: 750 m/s² {75G}

Destructive shock resistance: 1,000 m/s² {100G}

Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch)

Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)

TYPICAL APPLICATIONS

• Telephone exchange, transmission equipment

• Communications devices

• Measurement devices

• Home appliances, and audio/visual equipment

• Handheld and portable products

electronic integrated circuit

linear integrated circuits

AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY Images